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US Patent Issued to LS ELECTRIC on Sept. 29 for "Sensor device" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,747,990, issued on Sept. 29, was assigned to LS ELECTRIC Co. LTD. (Anyang-si, South Korea). "Sensor device" was invented by Hyun Wook Lee (Any... Read More


US Patent Issued to Yazaki on Sept. 29 for "Sensor component" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,747,991, issued on Sept. 29, was assigned to Yazaki Corp. (Tokyo). "Sensor component" was invented by Shinpei Kato (Makinohara, Japan), Shingo... Read More


US Patent Issued to ABB Schweiz on Sept. 29 for "Temperature sensor assembly and system" (German, Indian Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,747,992, issued on Sept. 29, was assigned to ABB Schweiz AG (Baden, Switzerland). "Temperature sensor assembly and system" was invented by Joe... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 29 for "Lateral bipolar junction transistor device and method of forming same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,747,993, issued on Sept. 29, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hisinchu, Taiwan). "Lateral bipolar junction tra... Read More


US Patent Issued to Auradine on Sept. 29 for "Temperature ramp control for integrated circuit chips" (California Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,747,994, issued on Sept. 29, was assigned to Auradine Inc. (Santa Clara, Calif.). "Temperature ramp control for integrated circuit chips" was ... Read More


US Patent Issued to MELECS EWS on Sept. 29 for "Method for determining the temperature in an electronic controller of a motor vehicle" (Austrian Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,747,995, issued on Sept. 29, was assigned to MELECS EWS GmbH (Siegendorf, Austria). "Method for determining the temperature in an electronic c... Read More


US Patent Issued to YAZAKI on Sept. 29 for "Sensor unit and sensor assembly" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,747,996, issued on Sept. 29, was assigned to YAZAKI Corp. (Tokyo). "Sensor unit and sensor assembly" was invented by Shinpei Kato (Makinohara,... Read More


US Patent Issued to Samsung SDI on Sept. 29 for "Testing method for a thermal contact" (Austrian Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,747,997, issued on Sept. 29, was assigned to Samsung SDI Co. Ltd. (Yongin-si, South Korea). "Testing method for a thermal contact" was invente... Read More


US Patent Issued to Analog Devices International UnLtd. on Sept. 29 for "Apparatuses and methods for implementing digital ledgers via phase change materials" (Irish, German, Spanish Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,747,998, issued on Sept. 29, was assigned to Analog Devices International UnLtd. Co. (Limerick, Ireland). "Apparatuses and methods for impleme... Read More


US Patent Issued to Zebra Technologies on Sept. 29 for "Multi-response single layer sensor platform" (New Jersey Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,747,999, issued on Sept. 29, was assigned to Zebra Technologies Corp. (Lincolnshire, Ill.). "Multi-response single layer sensor platform" was ... Read More